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【迪思科靠尖端半導體用研削機再次成長】面向生成式AI所需的最尖端半導體「高頻寬記憶體（HBM）」，迪思科用於切削出超薄晶圓的設備的銷售額正在增加。迪思科幾乎獨佔了面向HBM的研削設備的份額……
https://t.co/nN4le4LXhj
https://t.co/nN4le4LXhj
日經中文網 /
npub16t2…5al4
2024-11-22 04:34:11
Author Public Key
npub16t2gqzckn85fzp5hacda3c9df04pqwd5xgu5t5cmmqwf28ddxheq465al4Published at
2024-11-22 04:34:11Event JSON
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