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Koz Ross /
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2025-02-21 23:57:48
in reply to nevent1q…y6wu

Koz Ross on Nostr: nprofile1q…yv884 nprofile1q…726sn It's a bit of a missing stair IME. PLA is quite ...

nprofile1qy2hwumn8ghj7un9d3shjtnddaehgu3wwp6kyqpqkg056evtyrc66wf3jmwhwp5r8vmtganpclhltfkqxsd99e8a3y8styv884 (nprofile…v884) nprofile1qy2hwumn8ghj7un9d3shjtnddaehgu3wwp6kyqpq2atwfrq4rfv7fqara6gzsgrgj7k8ngewzl5nzs46agwyxzh0e25q6726sn (nprofile…26sn) It's a bit of a missing stair IME. PLA is quite prone to it, as is PETG when warm, which is one reason why, for example, enclosed printer parts shouldn't be made of PETG. However, creep-related information simply _does not exist_ on TDSes anywhere, and the testing we do have is inconclusive at best.

To give just one example, the mantra "PA6 creeps, PA12 doesn't" is _testably_ wrong for at least one line (Polymaker's).
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