Manawyrm | Sarah on Nostr: The risk is something different, called "Popcorning". When moisture in the components ...

The risk is something different, called "Popcorning".

When moisture in the components boils during reflow, quite violent destruction of the parts can occur.

Drying/baking before reflowing will get rid of the moisture beforehand.

https://www.pcbonline.com/blog/what-is-popcorn-effect-in-pcb-assembly.html